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* Changed function to enable flux smoothing and added missing psProcess functions in pybindings * Fix spellcheck typos
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@@ -123,7 +123,7 @@ Below the results after 1, 2, and 3 seconds of etching are shown. | |
<img src="https://raw.githubusercontent.com/ViennaTools/ViennaPS/master/data/images/hole_etching.svg" width=700 style="background-color:white;"> | ||
</div> | ||
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By changing the dimension of the hole etching example (_D = 2_), we can easily simulate the profile of a trench etching process with the same plasma chemistry. Here we can, for example, vary the mask tapering angle to observe increased microtrenching, as shown below. | ||
By changing the dimension of the hole etching example (_D = 2_), we can easily simulate the profile of a trench etching process with the same plasma chemistry. Here we can, for example, vary the mask tapering angle to observe increased micro-trenching, as shown below. | ||
<div align="center"> | ||
<img src="https://raw.githubusercontent.com/ViennaTools/ViennaPS/master/data/images/sidewall_tapering.svg" width=700 style="background-color:white;"> | ||
</div> | ||
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@@ -157,7 +157,7 @@ If you want to contribute to ViennaPS, make sure to follow the [LLVM Coding guid | |
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## Authors | ||
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Current contributors: Tobias Reiter, Julius Piso, Josip Bobinac, Xaver Klemenschits | ||
Current contributors: Tobias Reiter, Julius Piso | ||
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Contact us via: [email protected] | ||
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